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Patent Intelligence

World's first AI assistant for Patent Professionals

The Reasoning Engine

Where patent data becomes patent intelligence

Most patent tools wrap an LLM. We put a reasoning engine above it.

Your Patent Data docs · excel · claims
Clustering
Retrieval
Ontology
Knowledge Graph
Does the reasoning
AI Speaks human
Insights

What our users experienced

One of the cleanest UI we have seen

The report showed us how we could close the gap with the competitors

Problem statements in the report were highly relevant and useful for research planning

Dynamic reports are great and helped us engage with patent data better

Projects are easy to create, read and analyze

The report showed us that we are far behind our competitors

Whitespace insights had technical depth

The learning curve is smooth as compared to others

Patent
Landscape

From a patent list to an interactive landscape report in hours. Whitespace analysis & ideation cues in minutes.

AI Review & ML Classification

Machine learning clusters patents into technology groups automatically

Zone Analysis

Identify Emerging, Niche & Mature zones in the competitive space

Deep-Dive Ideation

Surface problem-solution pairs and whitespace opportunities

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AI Review & ML Classification

Mature 142 patents Emerging 67 patents Niche 38 patents

Zone Analysis

Emerging Top Problems & Impactful Solutions Niche Focused innovation Mature High competition Top Assignees IBM · Samsung · Qualcomm

Deep-Dive Ideation Insights

Emerging Cluster PROBLEM Heat dissipation in high-density packaging WHITESPACE Micro-channel cooling for 3D stacked ICs KEY PLAYERS Intel · Samsung · Qualcomm · TSMC ✦ 3 opportunities

IP SWOT Analysis

S Strengths Core filing in Battery Tech 18 patents expiring 2034+ Strong citation network W Weaknesses Gap in Thermal Management 3 patents under IPR challenge Narrow claim scope in Anode O Opportunities Whitespace in Solid-State Cells Licensing potential identified 3 adjacent whitespace zones T Threats Competitor filed 8 new patents 2 blocking patents identified Expiry cliff 2027: 5 patents

Defensive / Offensive Deep-Dive

Your Portfolio Competitors Shared Territory Defensive Moat Attack Surface

Patent Proximity Insights

14 patents · overlap Gap zone — A Gap zone — B

Portfolio
Analysis

Comparative analysis of two patent lists to know where you're strong, where you're exposed, and where the gaps are.

IP SWOT Analysis

AI-generated strengths, weaknesses, opportunities and threats across your portfolio

Defensive / Offensive Deep-Dive

Identify your defensive moat and competitor attack surfaces

Patent Proximity Insights

Lasso two patent clusters to reveal gaps, overlaps and proximity zones

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Risk
Analysis

Claim charting, key feature analysis, offense strategy and defense strategy.

Advanced NLP Feature Extraction

Breaking down your product document into claim-mappable technical features

Design-Around Insights

Visualise the claim boundary and find a clear path outside the risk zone

Evidence Strengthening

Element-by-element analysis to strengthen your evidence

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Advanced NLP Feature Extraction

Product Specification thermal interface substrate layer bonding method active layer heat dissipation

Design-Around Insights

Claim Scope Risk Zone Safe Zone Feature X Feature X ✓ Clear

Evidence Strengthening

Feature A Feature B Feature C Claim 1 Claim 2 Claim 3 Strong Strong Partial Strong Strong Partial Partial Strong ↑ Strengthen evidence

Ontology Powered Amendment Insights

Independent Claim 1 bonding method bonding method Broader: joining ↑ amend to broaden Narrower: thermal bond specific claim language Narrower: ultrasonic bond specific claim language Related: attachment analogous concept Amendment Suggestion Broaden "bonding method" → "joining" to capture thermal & ultrasonic variants 94%

Patent Graph for Estoppel Analysis

Application 2021-03 Office Action 2022-01 Prior art rejection Response Analysing amendment… Surrendered Scope — If this amendment is filed Amending "bonding method" to overcome the rejection surrenders thermal bonding variants from original claim scope High risk

Family Member Analysis

US 11,234,567 Granted Claim 1 — Granted A bonding method comprising a thermal interface layer… ↑ Use to harmonise IN filing IN 202X 12345 Pending Claim Harmonization Amended Claim (IN) Aligned with US granted claim scope & prosecution ✓ Portfolio harmonized

Prosecution
Analysis

Releasing July 31, 2026

Strengthen your patent applications with ontology-powered insights and targeted prosecution strategy.

Ontology Powered Amendment Insights

Deep analysis of claim concept, to derive amendment recommendations

Patent Graph for Estoppel Analysis

Trace your prosecution history to surface surrendered scope and estoppel risks

Family Member Analysis

Holistic full patent family analysis to power your portfolio harmonization

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Agentic Infringement
Analysis

Releasing July 31, 2026

User guided autonomous research agents to constantly map your patent claims with real-world products.

Agentic Claim Element Analysis

Each claim element matched to product evidence with confidence scoring

Product Search Plan

Claim becomes the root of an editable research tree — queries and results built live

Knowledge Graph Powered Deep Research

Agent crawls spec sheets, press releases and product pages across potential infringers

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Agentic Claim Element Analysis

PREAMBLE A semiconductor bonding method Strong match · 96% Product spec §1.1 — confirmed ELEMENT 1 comprising a thermal interface Strong match · 91% Press release 2024-Q2 ELEMENT 2 a substrate bonding layer Partial match · 67% Inferred from product teardown ELEMENT 3 wherein the bonding agent Strong match · 88% Patent filing cross-ref ELEMENT 4 configured to dissipate heat Strong match · 94% Thermal spec confirmed 4 of 5 elements matched · High infringement likelihood

Product Search Plan

Claim 1 Root "thermal bonding semiconductor" site:techcorp.com OR filetype:pdf "substrate bonding layer" product press release 2023 OR 2024 "heat dissipation" chip packaging datasheet spec filetype:pdf Plan ready 3 queries · 6 targets

Knowledge Graph Powered Deep Research

Patent Claim TechCorp searching… NexTech searching… InnoLabs searching… spec sheet press release product page patent filing spec sheet press release

Invention Coverage Analysis

Invention Disclosure live coverage → Novelty Claim Breadth Prior Art Completeness Claim Clarity Enablement 85 72 60 90 78 82 78% Coverage Score

Embodiment Builder

Invention Use Cases Where is it applied? IoT Sensor Networks industrial monitoring Medical Wearables patient monitoring Implementations How is it built? Flexible Substrate bendable form factor Rigid PCB Variant standard assembly Advantages What does it unlock? Cost Reduction −40% materials + assembly Power Efficiency +25% lower thermal load

Invention QC

Invention Claims Desc. Emb. Incomplete! Invention QC Analysis ✓ Novelty Check Pass ✓ Enablement Pass ✓ Written Description Pass ✓ Claim Clarity Pass ✕ Completeness Fix needed ✓ Completeness Pass QC Progress 92% Emb.

IdeaHat

Releasing July 31, 2026

From idea to patent-ready disclosure — structure, strengthen and QC your invention by answering just 5 questions.

Invention Coverage Analysis

Rule based analysis of your invention document for novelty, breadth, enablement and coverage

Embodiment Builder

Extend your invention into use cases, implementations and advantages

Invention QC

Broken branch triggers criteria analysis — issues flagged and resolved live

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